iPhone semiconductor components
1. Chips inside the Apple iPhone -
Under the Hood
2. Software is the heart of iPhone simplicity - Under
3. iPhone Live Disassembly - iFixit
4. Infineon, National, Balda and Samsung Score iPhone
Design Wins -iSuppli Teardown
1. Inside the Apple
Jul 01, 2007
Commack, NY — Semiconductor Insights' Allan
waited in line
for 12 hours and
elements get a
hold of the
Apple iPhone. He
and his intrepid
rolling as they
popped the cover
and dove inside
what is possibly
on the planet
(click icon for
The teardown is
a follow-up to
teardowns of the
Apple is doing
to make a strong
entry into the
released in the
United States at
6 pm local time
on June 29th.
The mass appeal
and interest in
the iPhone is a
and the ability
in the market
that have better
than the iPhone,
but much like
how there were
players than the
iPod, the iPhone
touch screen and
manager. "Not to
mention a really
The first thing
you say when you
see an iPhone
the iPhone in
some ways to the
Nintendo Wii ()
in that the
system is not
is what set it
apart from the
"The first thing
that strikes us
as SI looked at
the insides of
the iPhone, are
the number of
said Quirk. That
parts make up
the iPhone. To
get inside the
chips in acid to
three parts with
the Apple logo,
and another four
that seemed to
have a numbering
component is the
is a three
S5L8900 and two
512 Mbit SRAM
Quirk. While SI
has not seen the
before, it said
in smart phones
(Click on image to enlarge)
part is the
there is no
this part, but
SI believes it
provides the I/O
for the video
interface to the
the third part,
that start "with
of the six
part appears to
component is the
it appears that
one is a
is a multi-chip
and the third
(Click on image to enlarge)
"What is also
that are similar
iPhone and some
of the latest
"Apple is taking
surely made the
easier for them,
as they are
and how to
8-Gbyte MLC NAND
was used in the
iPhone. "This is
the exact same
was used in the
memory is used
to store things
in the 4-Gbyte
version of the
codec is the
WM8758. "This is
the same codec
that was used in
the iPod video,
making the sound
to what you
your iPod," said
the iPod, are
88W8686 is a
device, the same
die can also be
found in the
Wi2Wi 802.11 +
BlueCore 4 ROM
is a Bluetooth
device that was
also used in the
design win with
is known for
screen that are
of the screen in
to Quirk, Balda
has worked with
but this is
with 32 Mbytes
of NOR coupled
with 16 Mbytes
of SRAM for code
many in the
design win for
thought it would
be for an Intel
instead of flash
2. Software is the heart of iPhone simplicity
Jul 01, 2007
Commack, NY — Analysts at
Portelligent did a
quick overnight teardown of the Apple iPhone and
uncovered yet more semiconductor design wins, while
succumbing to an unusually high level of giddiness over
the simplicity and grace of the device and its
software-enabled user interface.
"To state the obvious, this is a milestone product
for both Apple and the wireless industry, so having a
place among the suppliers of key ICs that enable the
iPhone carries heavy bragging rights in the
semiconductor industry," said David Carey, president and
chief technology officer at Portelligent. "Without
pre-judging the commercial success of the iPhone itself,
there's no doubt that the semiconductor makers who have
chips in this product view their design-win as having
significance that goes beyond just the revenue
implications — it helps validate their solution and
Portelligent agreed with many of the findings of
Semiconductor Insights in its initial report (see:
Under the Hood: Inside the Apple iPhone), including
design wins by Infineon, Wolfson, Skyworks, Marvell,
CSR, Samsung, STMicroelectronics, Broadcom, Texas
Instruments and Linear Technology. However, it also
found a few more and disagrees with a couple of SI's
memory for the Samsung
processor is a package-on-package construction and
DDR SDRAM, not SRAM as indicated [by SI]," said
Carey. He also believes that the NXP part is the main
power management unit [SI pointed to the Texas
Instruments chip as the PMU], and that the NXP chip is,
"possibly corresponding to or similar to the PCF50633."
Carey also clarified that National Semiconductor got the
design win, "at both ends of a Mobile
Pixel Link LCD interface, one device on the board,
and another on the glass."
Adding to the list of design wins, Carey confirmed
that STMicro provides the LIS302 accelerometer and that
Micron got the 2-megapixel
CMOS imager win. "Others I suppose could be used if
it's a standard module and the same applies to the
storage NAND and a few other parts of a commodity
nature," he said. Finally, Amperex Technology Limited
supplied the Li-Poly battery, "but this too likely is
In summation, Carey said, "My overall reaction was an
engineering fascination at the shoehorning used to pack
it all in; dead airspace was kept to a minimum." While
the chips were interesting, Carey was enamored by the
software that gave the device its characteristic ease of
use. However, "Despite external simplicity and a serene
look-and-feel, the internal implementation is actually
quite complex," he siad. "There are many secondary
operations, fastener screws, and difficult orientations
needed for final assembly, making the manufacture of the
iPhone in China a near-must."
Try as he might to remain objective, this veteran of
many hundreds of teardowns of the latest technological
offerings, finally came clean: "I'm still a bit giddy
from playing with it — it really has a jewelery-like
quality in some respects. I'll reserve on further
gushing until potential warts emerge — I'm sure there
are some latent faults — but it's hard to deny the 'Wow
Factor' at the moment."
3. iPhone Live Disassembly by iFixit
- We've procured our iPhone,
and it's on the way to our
- We purchased two 8 GB
- The phone has arrived!
- OK, so here's a quick
overview of the basics.
- The iPhone is
4.5x2.4x0.5", and weighs 4.8 ounces (0.3
pounds). For reference, 18 iPhones weigh the
same as 1 MacBook Pro.
- The display is 3.5"
diagonal, 480x320 resolution. That's 153,600
pixels, or 12% as many as a 15" MacBook Pro.
- If you can't tell, we're
stalling while we figure out how to get it open.
- The iPhone supports four
major different wireless protocols.
- The List: Quad-band GSM
(850, 900, 1800, 1900 MHz), 802.11b/g WiFi,
EDGE, and Bluetooth 2.0 + EDR.
- Random facts:
- The iPhone has a 2
- It also has H.264 video
decoding, most likely in hardware.
- Front of the iPhone. The
battery was partially charged when we got it.
- iPhone's back.
- The SIM card is removable.
Push a paperclip into the hole on top, and the
card will come out (you may have to apply more
force than you'd expect).
- You cannot
use a SIM card from another provider without
unlocking the phone first. There is no current
way to use the iPhone internationally, or on a
- We've got the iPhone apart.
It was a little bit tricky.
- We removed the black
antenna plate first.
- You can see the grounding
screw on the back panel holding the antenna
cable and connecting the front and back case.
- Separating the front and
- There's a headphone jack
cable to disconnect before you can completely
remove the back panel.
- The headphone jack is
recessed into the case, so most headphone jacks
won't fit without an adapter (even if they're
the right 1/8" plug).
- Apple did this to reduce
the strain on the narrow metal jack when you
yank on the headphones. With this design, the
hard plastic cable jacket absorbs most of the
- The headphones have a
microphone built in, with a button that you
pinch to answer a phone call.
- At last! The moment you've
all been waiting for.
- The battery is huge, and
soldered to the logic board.
- You can see the SIM card
bracket and headphone jack on the rear panel.
- The battery has Apple model
number 616-0290 L1S1376APPC.
- 3.7 V Li-Ion Polymer
- You can see at least two
antenna cables connecting to the logic board.
- Disconnecting the two
- There's a dab of glue
underneath both of the antenna connectors,
presumably for reliability.
- One has to imagine that
Apple was extra-paranoid about reliability on
this phone. They've certainly learned their
lessons from the iPod.
- Removing three Phillips #00
screws securing the logic board to the front
panel. The screws are:
- Where the screwdriver is
- Underneath the black
camera in the upper right hand corner.
- To the left of the battery
wires that are soldered to the logic board.
- Removing the camera, on the
top of the phone. This is the standard camera.
- Removing ten Phillips #00
screws around the perimeter of the iPhone.
- Lifting up the logic board.
There are three connectors underneath. They are
speaker, touch sensor, and display cables.
- Disconnect the two
connectors on the left side of the image.
- Disconnect the remaining
- Flip up the retaining bar
to free the dock connector cable.
- Close-up shot of the logic
board. The logic board is two layers thick, so
it's difficult to see components.
- We haven't found a way to
pry the two sections apart without damaging the
logic board, so it's virtually impossible to
tell you what's in there.
- View of the iPhone with the
logic board and battery removed.
- Disconnect the antenna
cable to the left of the dock connector.
- Peel up the antenna ribbon
sheet from the large black plastic piece
- You can now see why the
iPhone has the black lower section of the back
case. The antenna encompasses this entire
- Remove the hollow black
plastic piece that was covered by the antenna.
- There is some empty space
within it — the only open internal space.
- There's a chip in the upper
right that may be a touch screen control
processor. Model numbers: S6087P1, GN03325,
2076A00R, and 1YFZASB3
- The iPhone is completely
- The phone had about 16
screws total, unlike many iPods. The iPod Nano
only has three screws.
- After further examination,
we found a way to open the logic board without
completely destroying it like
Think Secret did.
- Samsung chip underneath the
metal shield on the left side of the board on
the left. Ours reads K9MCGD8U5M. The 4 GB model
that Think Secret took apart had K9HBG08U1M on
it, which is a 4 GB chip.
- Samsung manufactured Apple
ARM chip. Numbers: 339S0030ARM, 8900B 0719,
NOD4BZ02, K4X1G153PC-XGC3, ECC457Q3 716. The
processor is likely stacked on the SDRAM, which
looks to be 512 MB. This chip could have
H.264 and MP3 hardware decoding built in.
- The chip above the ARM is a
audio chip. Part numbers WM8758BG and
- The chip underneath the ARM
is a Linear Technology 4066
USB Power Li-Ion Battery Charger, which
Apple uses in the iPods as well.
- The chip on the bottom
center that looks blank in our image actually
has this text: MARVELL, W8686B13, 702AUUP. This
Marvell's 802.11b/g 18.4mm2 chip.
- The chip in the upper right
Skyworks GSM/Edge Power amplifier (SKY77340)
- The silver chip to the left
of the Skyworks chip reads CSR 41814 3A06U
K715FB. This is a
CSR BlueCore4-ROM WLCSP single chip radio
and baseband IC for Bluetooth 2+EDR.
- The chip covered by the
white sticker in the photo has the part numbers
338S0289 and 8G60710 on it.
- The chip with the blue dot
on it is rumored to be an Intel 32 MB NOR flash
chip. Part numbers 1030W0YTQ2, 5716A673, and
- The chip in the lower right
reads 338S 0297 G0719, EL629058S03.
- If you have any additional
information about any iPhone chips or internals,
us and we'll post the information
4. Infineon, National, Balda and Samsung Score
iPhone Design Wins, iSuppli Teardown Analysis Reveals
July 3, 2007
In terms of cost, iSuppli Corp.’s teardown analysis of the
iSuppli’s teardown, conducted this weekend, determined that the 8Gbyte
version of the iPhone has a total hardware BoM and manufacturing cost of
$265.83, generating a margin in excess of 55 percent on each 8Gbyte
iPhone sold at the $599.00 retail price,” said Andrew Rassweiler,
principal analyst for iSuppli.
In January, before iPhones were available for physical teardown, iSuppli
estimated a $264.85 hardware BoM and manufacturing cost for the 8Gbyte
Note that these costs do not include royalties and logistics expenses.
iPhone Semiconductor Winners
Infineon, a new supplier to the iPod family, was among the biggest
winners in terms of semiconductor content. The German semiconductor
supplier contributed the digital baseband, radio-frequency transceiver
and power-management devices, providing much of the core communications
capability of the iPhone. Altogether, Infineon’s silicon content
accounted for $15.25 worth of the iPhone BoM, representing 6.1 percent
of the 8Gbyte version of the product’s total cost.
National’s contribution to the iPhone BoM is relatively small, with its
lone chip in the product costing $1.50, which represents less than 1
percent of total product cost. However, the part—a serial display
interface—represents an important design win for National, which has
never had a part in an iPod. The chip, which connects the display to the
graphics controller, uses National’s Mobile Pixel Link standard, which
the company has been attempting to promote for use in mobile devices.
This is a significant win for National in a high-profile platform that
is expected to ship in large volume.
TPK Solutions (Balda) Gets Touch Screen Module, Epson Gets Display
One of the key features of the iPhone is the display, and the supplier
for the display module in the model torn down by iSuppli was Balda of
Germany in association with its partner TPK Holding of China. The module
costs an estimated $27, representing 10.8 percent of the 8Gbyte model’s
The iPhone touch-screen display itself is supplied by multiple sources:
Epson, Sharp and Toshiba Matsushita Display Technology Co. Ltd. The cost
of the unusually thin touch screen used in the iPhone is estimated at
$24.50, representing 9.8 percent of the 8Gbyte version’s costs.
Samsung Scores Again
Perhaps the biggest winner among the component suppliers for the iPhone
was Samsung. The South Korean electronics giant supplies the iPhone
applications processor, which includes an ARM RISC core. The processor
costs $14.25 in both versions of the iPhone.
The company also contributed the NAND flash memory and DRAM for the
iPhone. In the 4Gbyte version, Samsung has $24 worth of NAND flash, and
$48 in the 8GByte version. For both versions, Samsung supplies 1Gbit of
Double Data Rate SDRAM worth $14.00.
Samsung has $76.25 worth of semiconductor content in the 8Gbyte version
of the iPhone, giving the company a 30.5 percent share of the product's
hardware cost—the largest total of any single supplier.
Other companies scoring design wins in the iPhone include:
- Wolfson, which continues to maintain its design win for the
audio codec a notable achievement given the obvious challenge to
maintain design wins from generation to generation in the iPod
- CSR plc, which supplies the iPhone Bluetooth silicon costing
- Marvell, which is contributing a Wi-Fi baseband chip costing
Sales of the iPhone have kicked off with a bang, and iSuppli believes
that this strong performance will continue. Shipments of iPhones are
expected to amount to 4.5 million units this year, and will expand by a
factor of nearly seven to reach more than 30 million by 2011, according
to Tina Teng, analyst, wireless communications, for iSuppli. The figure
below presents the iSuppli forecast of annual iPhone unit shipments.