Teardown of Apple's iPhone 3G - Updated
1.
Apple Stresses
Cost Reduction for iPhone 3G
2. Inside Apple
iPhone 3G exposed -EETimes
3.
The $199
iPhone: still a money maker - EE Times
4.
Virtual teardown puts Apple’s iPhone 3G margin at 56%- Fourtune
5.
iPhone 3G saves Apple over $50 per unit - AppleInsider.com
6. Inside the
Latest iPhone - BusinessWeek.com
7.
Apple's 3G iPhone: Cheaper For You To Buy, Cheaper For Apple To Build -
alleyinsider.com
______________________________________________________________________________________________________________
Jonathan Cassell/ iSuppli Corporation
July 15, 2008
The new iPhone 3G sports an evolutionary design that favors cost
reduction instead of cutting-edge features, supporting Apple Inc.’s goal
of expanding its market share and achieving a worldwide presence for the
product, according to a physical teardown analysis conducted this
weekend by iSuppli Corp.
iSuppli’s Teardown Analysis Service on July 11 obtained an iPhone 3G and
commenced a dissection in order to identify component suppliers, as well
as to determine preliminary part and system costs. Per the teardown
analysis and subsequent examinations by analysts, iSuppli has issued a
preliminary estimate of $174.33 for initial production costs for the
8Gbyte iPhone 3G.
This figure consists only of the iPhone 3G’s combined Bill of Materials
(BOM) and manufacturing expenses. The total doesn't include other costs,
including software development, shipping and distribution, packaging and
miscellaneous accessories included with each phone.
iSuppli’s cost estimate is nearly identical to the $173 BOM predicted in
iSuppli’s virtual teardown issued to the public in late June.
Cost considerations rule in new iPhone
At $174.33, the BOM and manufacturing cost of the new iPhone is markedly
less than the $227 that iSuppli estimated for the first-generation,
8Gbyte 2G iPhone in June 2007. While using a new design, the iPhone 3G
really represents a refinement of the original iPhone 2G, according to
iSuppli.
“The addition of 3G wireless capability represents an evolutionary
design step for the iPhone, not a revolutionary one,” said Andrew
Rassweiler, teardown services manager and principal analyst at iSuppli.
“iSuppli believes Apple aimed for a more cost-effective design for the
3G iPhone compared to the 2G, in order to lower the retail price—which
will allow the company to seed adoption and to capture maximum market
share now—while the company still has buzz and a perceived
differentiation relative to its competitors.”
The iPhone 3G’s use of an Infineon Technologies AG baseband chip that
supports the HSDPA, WCDMA and EDGE air standards, plus the integration
of three separate TriQuint Semiconductor Inc. tri-band WCDMA Power
Amplifier Modules (PAMs), reflects the fact that the iPhone 3G is suited
for sale worldwide.
Infineon takes key baseband slot
The attached table presents iSuppli’s preliminary analysis of components
and suppliers for the iPhone 3G, determined via physical teardown.
iSuppli has conducted a teardown analysis of only one 3G iPhone. While
there are variations in the components and suppliers for individual
products, iSuppli believes that the vendors and parts identified in its
teardown likely are representative of all iPhone 3Gs now being
shipped—excluding certain memory devices and other commodity parts that
are available from multiple sources.
After
iSuppli has completed an analysis of a larger sample of iPhones, we will
issue further information to the public.
Infineon AG was the big winner in the key baseband section of the iPhone
3G torn down by iSuppli, contributing its HSDPA/WCDMA/EDGE chip that
includes dual ARM926 and ARM7 microprocessor cores. Solely-sourced items
include Infineon’s baseband solution, RF transceiver and Global
Positioning System (GPS) devices; Samsung Electronics Co. Ltd’s
applications processor integrated with Synchronous DRAM (SDRAM); Marvell
Technology Group Ltd.’s WLAN device and Cambridge Silicon Radio’s
(CSR’s) Bluetooth chip.
Multi-sourced items include Toshiba Corp.’s 8Gbyte NAND flash memory
chip. Apple’s other likely sources for this part include Samsung.
Design insights
Other observations made by iSuppli’s analysis team include:
- The redesigned internals of the iPhone 3G include only one large
Printed Circuit Board (PCB), instead of the two nested PCBs found in
the 2G version. The iPhone 3G uses a 10-layer board, compared to the
less-expensive six-layer PCBs commonly employed in mobile handsets.
- The battery is not soldered into the iPhone 3G as it is done in
the 2G, making it more serviceable.
- Some chips have the Apple logo or are unmarked. Although iSuppli
has been able to identify many of these parts and their true
manufacturers by de-capping the chips and examining their dies, some
devices remain unidentifiable at this time.
iPhone costs
Beyond the $174.33 BOM and manufacturing cost of the iPhone 3G, Apple is
spending an estimated $50 on IP royalties per unit shipped. With the
8Gbyte version retail-priced at $199, and the estimated $300 subsidy
paid by AT&T to Apple for each unit, Apple is selling the product at a
price of $499, and spending $224.33 to produce each one. This gives
Apple a BOM, manufacturing and royalty margin of 55 percent for each
8Gbyte iPhone 3G unit sold.
Top
______________________________________________________________________________________________________________
Patrick
Mannion/
EETimes/
Under the
Hood -
Jul 12, 2008
Editor's
Note: For
more
insight,
view the
full
videotaped
teardown
analysis by
clicking
"Video:
Inside
iPhone 3G"
Updates
from you,
TechOnline's
Community,
are at the
end and are
marked with
an '*'.
Keep 'em
coming...
Commack,
NY -- Aside
from some
very
surprising
component
choices in
key parts of
the
up-graded
communications
section, as
well as some
software
improvements
and some
basic design
tweaks, the
old adage
'if it ain't
broke, don't
fix it' has
clearly
shaped the
design of
the iPhone
3G, the
follow-up to
Apple's
phenomenally
successful
launch of
the iPhone
line of
handsets.
"It's
incrementalism
at play,"
said David
Carey,
president of
teardown
specialist
Portelligent.
"They
learned a
bit from
their
'Touch'
solution and
replaced two
boards with
one."
Instead
of trying to
reinvent the
device,
Apple
focused on
enhancing
the user
experience
and
expanding
its fan
base. It has
done this by
not only
expanding
its
geographical
footprint
and speeding
up its
wireless
connection,
but also
through the
iPhone
applications
development
network.
Clearly one
of the
bigger
stories
behind the
3G
launch, the
developer
program will
see Apple
providing
resources,
real-time
testing and
distribution,
to
accelerate
the delivery
of more
diverse
applications
to the
consumer.
The
success of
that program
will be
determined
over the
coming
months, but
for those
consumers
with an
iPhone 3G in
hand, there
will be
little to 'oooh'
and 'aaah'
about, aside
from the 3G
data rates,
where
available.
From the
outside, the
phone looks
very much
the same,
except for a
plastic
backing and
a move away
from a
recessed
headphone
jack to a
flush
connector.
It has the
same look
and feel and
the same 2
Mpixel
camera
feature.
That said,
it does add
built-in
GPS
capability
and MobileME
application
software.
Diving
Under the
Hood,
analysts
from
Portelligent,
as well as
TechOnline
and
Semiconductor
Insights,
were taken
aback by the
strength of
Infineon's
wins in the
3G
communications
portion, as
well as the
inclusion of
TriQuint for
three
front-end
modules.
"Infineon
clearly made
their mark
on this
board with
four key
design
wins," said
Allan
Yogasingam,
a TechOnline
technology
analyst.
"And
TriQuint
really came
from left
field with
their win
their
modules. I
didn't see a
single
press-release
or
speculative
article
hinting at a
relationship
between the
two
companies.
In today's
internet
world,
that's a
tough thing
to keep
under
wraps."
(Click on image to enlarge)
As
previously
reported,
TriQuint
provides
three
power-amplifier
(PA)
front-end
modules, the
first is the
TQM676021,
which is an
integrated
3-V linear
UMTS
Band 1 power
amplifier
(PA),
duplexer and
transmit
filter
module, with
output power
detector. It
supports
HSUPA
operation
with
transmission
data-rates
up to 10
Mbits/s.
Next is the
TQM666022,
a similar
device, but
for Band 2
operation.
Finally
comes the
TQM616035
WCDMA/HSUPA
PA-duplexer
module for
Band 5 and 6
(no
datasheet
available).
Moving up
the signal
chain,
Infineon won
big. It
supplies the
UMTS
transceiver,
suspected to
be the
PMB 6952,
as well as
the baseband
processor,
which is
actually a
two-chip
module in a
single
package. The
first chip
is the
X-Gold 208 (PMB
8877),
which caters
to GSM/GPRS/EDGE
waveforms.
The second
chip is
marked the
PMB 8802 and
is suspected
to be the
WCDMA/HSDPA
accelerator
for 3G.
While
there's
still some
debate as to
whether this
combo
package with
Apple
markings may
in fact be
Infineon's
XGold 608 (PMB
8878),
which Quirk
and
Yogasingam
expected to
see, that
chip has as
yet not
become
available to
verify under
Semiconductor
Insights'
microscope.
In any
case, that
it's broken
into two
chips is
surprising,"
said Carey,
given that
both Nokia
and Qualcomm
have
integrated
both
functions it
into a
monolithic
die.
However,
there may be
more to the
decision
than design
choice. "We
suspect the
second die
has
something to
do with one
of the
InterDigital
patents,"
said
Yogasingam,
referring to
an
Apple,
InterDigital
patent
dispute
last year.
The
baseband's
support
memory comes
courtesy of
Numonyx, the
Intel/STMicro
spin-off. It
includes 16
Mbytes of
NOR flash
and 8 Mbytes
of
pseudo-SRAM
(PF38F3050M0Y0CE).
Rounding
out the
communications
function is
the Skyworks
SKY77340
824- to
915-MHz
quad-band
GSM/EDGE
amplifier
module, the
same part
used in the
original
iPhone.
Power
management
in the
iPhone 3G is
split
between two
ICs: the
communications
portion of
the device
is handled
by
Infineon's
SMARTi Power
3i,
while
system-level
power
control and
management
is handled
by NXP
(exact
device to be
determined,
though Carey
believes
it's the
#PCF50633,
as per the
original
iPhone.)
The
Linear
Technology
LTC4088-2
takes care
of battery
charging and
general USB
power
control.
Built-in GPS
Aside from
3G
capability,
one of the
big
differentiators
of the new
iPhone
device is
its built-in
GPS
capability,
which is
provided by
yet another
Infineon
chip, this
time the
PMB 2525
Hammerhead
II. "In
the old one
[original
iPhone], GPS
was software
enabled and
was accurate
to within
blocks,"
said Quirk.
"This time
it's
accurate to
within
meters."
The
Hammerhead
II
integrates
an
assisted-GPS
(A-GPS)
baseband
processor
with a
low-noise
GPS RF front
end and
multi-path
mitigation
to avoid
large errors
in urban
environments.
While the
die markings
indicate
it's
actually a
PMB 2520
Hammerhead I
chip, Quirk
pointed out
that it's
common
practice
take the
same die,
make some
fairly
simplistic
connection
or routing
changes to
alter or
improve
functionality,
and then
re-label it
as a 'new'
chip.
For the
main
applications
processor,
Apple chose
to stick
with a
tried-and-true
Samsung
ARM11-based
design, with
some tweaks,
supported by
128 Mbytes
of stacked,
package-on-package,
DDR
SDRAM, also
from
Samsung.
Externally,
the main
memory comes
in two
versions for
the iPhone:
8 Gbytes and
16 Gbytes of
NAND flash.
In this
case, it's 8
Gbytes, but
the source
was
surprising:
Toshiba, in
the form of
a
single-chip
device
segmented
into four, 2
Gbyte die
(TH58NVG6D1D).
According
to Quirk,
the choice
of Toshiba
was unusual
given that
Apple had a
"huge" deal
to buy all
Samsung
memory. It
also was
reportedly
discussing
plans for
volume
purchase of
NAND flash
chips that
will be used
in all iPods
and iPhones
from June to
December
2007
(Source:
EETimes
Asia.)
"To see
Toshiba
makes me
wonder if
that deal is
no longer in
place," he
said.
Granted,
those deals
are aging,
he
acknowledged,
"but now
that the new
iPhones have
come out and
seem to be
using
Toshiba,
does this
mean that
Samsung is
playing
second
string to
Toshiba? It
could mean
some good
stock boost
for
Toshiba!"
With
regard to
the current
16-Gbyte
maximum
offered with
the iPhone
3G, Quirk
suspects
that may not
be enough,
given that
half a
gigabyte can
disappear
for just one
compressed
movie. Add
photos and
MP3 files
and Quirk
sees that 16
Gbytes
getting
eaten up
pretty fast.
The
SST25VF080B
8-Mbit
serial flash
chip from
SST rounds
out the
iPhone 3G's
memory
support.
The
tried-and-true
philosophy
symbolic of
the new
iPhone
extends to
the
accelerometer,
the
LIS331 DL
from
STMicroelectronics,
as well as
the
single-chip
88W8686
single-chip
Wi-Fi
offering
from
Marvell. The
Marvell chip
is
accompanied
on the back
of the main
board by a
CSR
BlueCore6-ROM
Bluetooth
chip, which
surprised
the
analysts,
all of whom
were
expecting to
see the same
BlueCore4
device used
in the
original
iPhone.
(Click on image to enlarge)
Rounding
out the main
chips on the
iPhone are
the Wolfson
WM6180C
audio codec,
which
replaces the
WM8758 used
on the
original
iPhone, as
well as the
Broadcom
BCM5974
touchscreen
controller,
National
Semiconductor
LM2512AA
Mobile Pixel
Link display
interface
and the
Texas
Instruments
#CD3239
touch screen
line driver.
The new
iPhone's
touchscreen
approach is
the same as
that of the
iPod Touch,
said Carey.
The Gen1
iPhone had
three chips
for the
touch screen
solution: a
Broadcom
controller,
a NXP 32-bit
uP, and a TI
line driver.
The Touch
reduced this
to just a
revised
Broadcom
chip (which
absorbed the
microprocessor
function)
and the TI
line driver.
"The 3G uses
the same
Broadcom
chip as the
Touch, and
an updated
TI line
driver
(smaller
chip)."
While
Apple's
rollout of
the iPhone
3G may not
have been
met with the
same
frenzied
reception as
the
original,
its fan base
remains
strong,
according to
Yogasingam.
"After
spending the
better part
of the night
(see:
Video: The
long wait
for iPhone
3G) with
people
waiting in
line for an
iPhone, I'm
still amazed
at how many
people have
embraced the
Apple brand
and are
willing to
do anything
to be an
early
adopter of
anything hip
and new from
Apple. Apple
has this air
with its fan
base that it
could do no
wrong."
From
the
TechOnline
Community
*
The Samsung
applications
processor
contains
Imagination
Technologies
Power VR MBX
Lite again
(3D HW
acceleration)
- (hopefully
SGX will
feature in
the Ipod
Touch update
later this
year -- you
will be
aware of the
Samsung
manufacturing
licence for
SGX and
video cores
with
Imagination.)
(Thanks,
Naveed.)
Related
stories:
Video:
Inside
iPhone 3G
Video: The
long wait
for iPhone
3G
Canadians to
iPhone: No
thanks!
Intel's Atom
already
designed
into future
iPhone, say
reports
Lower costs,
higher
profits for
Apple with
3G iPhone
Mission:
impossible?
Buying an
Apple iPhone
3G on launch
day
Under the
Hood: Inside
the
[original]
Apple iPhone
The $199
Apple iPhone
[3G]: still
a money
maker
|
|
Top
_______________________________________________________________________________________________________________
By Rick Merritt/ EE
Times
June 09, 2008
SAN JOSE, Calif. — Apple is
likely to reap significant
profits despite slashing the
cost of its updated iPhone
in half, said analysts.
Although details about the
phone are still scarce,
sources said they believe
Infineon and Samsung have
continued to snag the top
chip designs in the handset.
The raw cost of materials to
build the iPhone 3G could be
nearly half that of the
original model, according to
Portelligent Inc. (Austin)
that conducted a teardown
analysis of the first
handset. The first phone had
a bill of materials
estimated at $170 at launch,
but the iPhone 3G could have
a BOM as low as $100 when it
debuts July 11, said David
Carey, president of
Portelligent, a division of
TechInsights, the publisher
of EE Times.
The cost cut is also
strategic for a company
seeking to extend its
toehold in the massive
cellular market. Apple has
sold 6 million iPhones to
date mainly in the U.S. in a
market where nearly a
billion handsets ship each
year worldwide.
"Gen2 iPhone pricing is
aggressive enough that it
made me think Apple's really
taking the gloves off on
this one," said Carey. "They
are probably not as worried
about iPhone hardware
profits as they are about
getting a piece of the
action on service revenues
and getting more Macs in
homes and offices all around
the globe," he added.
Indeed, Apple launched a new
subscription service called
MobileMe for the iPhone 3G.
The original iPhone used the
2.5G EDGE network which
delivers a maximum 256 Kbits/s.
The new iPhone 3G uses the
HSDPA version of W-CDMA, a
standard which supports a
minimum of 1.5 Mbits/s and
up to 7.5 Mbits/s on some
chips sets, including one
from Infineon.
"I do believe they are
continuing to use an
Infineon baseband and RF
transceiver and a Samsung
applications processor,"
said Will Strauss, principal
of market watcher Forward
Concepts (Tempe, Ariz.)
based on information from a
source he would not name.
Strauss said he expects the
new model also uses a global
positioning system chip from
Infineon based on technology
it licensed from startup
Global Locate which was
recently acquired by
Broadcom Corp.
Carey said some observers
speculated the iPhone 3G
uses Infineon comms chips
based on some of the code
seen in the software
developer's kit for the new
version of the handset.
Last month Samsung launched
a handset using the same
Infineon and Samsung
baseband, RF and processor
chips. At the time, Samsung
stated the Infineon chips
cost 20 percent less than
similar chips from rival
Qualcomm, Strauss said.
Strauss said he believes the
entire bill of materials for
the Samsung phone could be
20 percent less than a
similar design based on
Qualcomm chips.
Carey of Portelligent said
several factors make the
iPhone 3G potentially much
cheaper to build than the
original iPhone.
"I'd suspect the collective
volume, learning and
engineering changes to the
display would mean that the
whole touch screen assembly
might be about half the $60
or so we estimated for Gen1
a year ago," Carey said. "In
addition, the 8 Gbytes of
MLC NAND is today around $20
compared to the $50 that
might have been the case in
June 2007," he added. Carey
estimated Apple may have
shaved another $25 off the
bill of materials costs
based on changes he observed
in a teardown of the iPod
Touch.
Those changes are only
slightly offset by new costs
for the iPhone 3G. Carey
said the additional cost of
an HSDPA chip set are only
about $15 plus another $5
for the GPS chip. He also
noted that the $100 price
increase for a model with 16
Gbytes flash adds to the
profit margin because the
additional memory chips
probably cost Apple only
about $20.
Netting out all the changes
Apple may have had a gross
profit based solely on cost
of hardware for the original
iPhone of $229 and profits
of just $99 for the iPhone
3G. "It's always important
to point out that hardware
BOM costs do not capture
many other important facets
of product cost such as
development costs, software
costs, licenses and
marketing," he said.
Though profits may be lower,
Apple is likely to sell many
more units with the new
iPhone, said Strauss. Some
big markets such as Korea
and Japan do not use the
EDGE network of the original
iPhone, but they do use
HSDPA.
Apple announced agreements
with a wide range of
carriers across Asia, Europe
and the U.S. who will sell
the iPhone 3G, 22 of them
starting on July 11. About
another 50 carriers will
provide the handset before
the end of the year, said
Apple chief executive Steve
Jobs who announced the
handset at Apple's developer
conference Monday (June 9).
"I think Apple is going to
do very well with this
phone," Strauss said. "The
fact they have this updated
air interface opens many new
markets for them," he added.
Both Carey and Strauss noted
carriers may be providing an
undisclosed subsidy for the
new iPhones. AT&T for
example, sold a high end
Palm Treo phone for $199
after a subsidy, Strauss
said.
Carey said the new iPhone
probably contains a larger
battery based on claims of
longer battery life. Apple
could easily maintain the
existing weight of the
handset by using lighter
materials in the casing such
as plastics which could also
improve the cellular
reception of the device.
Top
_______________________________________________________________________________________________________________
June 24, 2008, 8:06 pm
By Philip
Elmer-DeWitt /
FourtuneEven though none of
the teardown shops
has yet to get its
hands on one of the
new iPhones, we now
have two estimates
of how much the 8GB
model costs Apple to
build.
The first,
from Austin-based
Portelligent,
put the Bill of
Materials alone at
$100. (see
here)
The second,
issued Tuesday by
iSuppli in El
Segundo, CA, is more
detailed and
probably more
accurate. As shown
in the chart below,
iSuppli came up with
a BOM of $126.84
before $9 in
manufacturing costs
and $37.16 in
unspecified “other
costs” brought the
total to $173. (link)

Also not included
in iSuppli’s $173
total are an
estimated $45 in
royalties that Apple
must pay to Qualcomm
(QCOM)
and others (see
here) and fees
due Hon Hai (Foxconn),
Apple’s Taiwanese
manufacturing
partner.
Still, Apple has
managed to build the
second-generation
iPhone for 23% less
than the first one,
by iSuppli’s
calculation, while
selling it to the
carriers for roughly
the same price.
iSuppli estimates
that Apple (AAPL)
is collecting $499
per phone from the
carriers ($199 sale
price plus a $300
subsidy), for an
effective margin of
56%. Other estimates
put the subsidy in
the $325 to $350
range, which would
push the markup even
higher.
Below the fold:
Commercial Times’
best guess of who is
supplying the parts
listed above, as
translated by
DigiTimes.

Top
_______________________________________________________________________________________________________________ |
|
|
By Aidan
Malley /AppleInsider.com
Monday, June 23, 2008
Even with the newer technology inside iPhone 3G, Apple has
managed to trim the price of its handsets by over $50 and is making
even more profit on each sale, according to a new cost breakdown by
iSuppli.
The supply analysis group
estimates that the raw cost of parts and assembly for a stock
8GB iPhone now costs Apple $173, or $53 less than the $226 it first
cost Apple for the earlier cellphone.
Much of the breakthrough comes through leaving many existing
components intact. While the Infineon 3G chipset and the Broadcom
Global Locate GPS unit are new, the Samsung processor, flash
memory, and numerous other parts are the same as for the 2007-era
iPhone, more than offsetting the price increase that stems from the
addition of 3G and GPS.
"They [at Apple] have done a good job in using what worked well with
the first one and making improvements where it mattered," says
iSuppli analyst Jagdish Rebello.
Although some fees can't be escaped, including $45 in royalties to
Qualcomm and others for a 3G license, the savings are said to give
Apple roughly $281 in profit with each phone's estimated full,
pre-subsidy $499 price -- or a more than 56 percent profit margin.
This doesn't, however, include shipping, sales, and the cost of
bundling pack-in devices, according to the study. Apple's actual
profit from each device is anticipated to be less, though the 16GB
model is believed to be more profitable as the extra memory adds
just $23 to the cost despite the $100 boost to the retail price.
Apple's cost reductions should also get steeper as time goes on,
iSuppli adds. Apple's price to build an iPhone could drop to $148 by
2009, extending the electronics maker's margins even further ahead
of the next major iPhone update.
AppleInsider should have more information soon.
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by
Arik Hesseldahl /BusinessWeek.com
June 23, 2008, 5:15PM EST
For the upcoming iPhone 3G, Apple has reduced
manufacturing and component costs by more than $50 per unit, says
iSuppli
Apple packed a lot of features into the latest version of the
iPhone but managed to keep a tight lid on the cost of components
that go into it. Manufacturing and components for the 8-gigabyte
iPhone 3G set Apple back about $173 per unit, according to an
estimate by Silicon Valley-based research firm
iSuppli, due to be released June 24. Comparable expenses for the
earlier iteration of the iPhone were about $226, iSuppli says.
Analysts scour component-price estimates to gauge profit margins
on Apple's best-selling products, while keeping a close eye on which
supply manufacturers have won the potentially lucrative contracts
from Apple. Falling component prices let Apple (AAPL)
add new features, including navigation tools and faster Internet
download speeds, while maintaining healthy margins, say iSuppli
analysts, whose estimates are preliminary. The iPhone 3G is due to
be released July 11. "They have done a good job in using what worked
well with the first one and making improvements where it mattered,"
iSuppli analyst Jagdish Rebello says.
Consumers who purchase the iPhone in Apple and AT&T (T)
stores will pay $199 for the 8GB version, but AT&T will subsidize a
big chunk of the price of each phone—an estimated $499 for each
device. AT&T hopes to make up for the expense through monthly
service packages but will take a bottom-line hit of 10¢ to 12¢ a
share through the end of 2009. After royalties, Apple's per-unit
profit on an 8GB iPhone works out to about $281, or about 56%, in
keeping with the percentage on other Apple products, iSuppli says.
The figure doesn't include other costs, including software
development, shipping and distribution, packaging, and miscellaneous
accessories included with each phone. Apple also pays fees to its
Chinese manufacturing partner,
Hon Hai Precision Industry.
Apple added parts that enable faster download speeds and
navigation features, via Global Positioning System satellites. One
big winner appears to be the German chipmaker Infineon (IFX),
which iSuppli says won the contract to supply the 3G wireless
chipset. Broadcom (BRCM)
unit Global Locate will supply the GPS chipset.
Most Components
Unchanged
Aside from those changes, most of the components used in the
original are likely to remain unchanged. "It makes sense that Apple
would go with the same design and not change very much inside,"
Rebello says.
Samsung is thought to be supplying the same applications
processor as on the original iPhone. The specifications of other
chips haven't changed much either. The new iPhone's camera boasts a
picture quality of only two megapixels—again, the same as on the
original. Idaho-based chipmaker Micron (MU)
likely stayed in place as the supplier, though at a lower cost,
Rebello says.
The most expensive parts are the memory chips. Eight gigabytes
worth of NAND-type flash memory costs about $23, and about double
for 16 gigabytes. Suppliers of the NAND chips are many, and include
Samsung,
Hynix, and IM Flash Technologies, a joint venture of Micron and
Intel (INTC).
Apple also has to pay about $45, or about 9% of the price of each
handset, in royalties for patented 3G technologies, according to the
iSuppli analysis. Chief among these collectors of royalties is
wireless chipmaker Qualcomm (QCOM),
who owns several patents related to a technology known as WCDMA used
in the 3G chipsets. Others that may be collecting some royalties
include Sweden's Ericsson (ERICY)
and Finland wireless giant Nokia (NOK).
Another difference this time around: Apple and AT&T have
abandoned the revenue-sharing agreement that gave Apple an estimated
30% to 35% of the monthly service revenue generated from iPhone
contracts. Apple is making up for the lost revenue with the subsidy
from AT&T.
Apple is also likely to benefit from further declines in the
component prices. The component price tag is likely to drop to $148
in 2009 from the current $173, iSuppli estimates. That bodes well
for the company's gross margins, which widened to 34% in the first
six months of the current fiscal year, from 33% in the year-earlier
period.
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Dan Frommer /.alleyinsider.com
June 23, 2008 6:00 PM
iphone ad.jpgHow will Apple (AAPL) get away charging $199 for its new 3G
iPhone when it launches next month? In part by getting wireless carriers
to subsidize the phones by several hundreds of dollars. But also by
cutting the cost of materials and manufacturing more than $50 per phone,
according to an iSuppli report summarized by BusinessWeek.
The 3G iPhone doesn't come out until July 11, so iSuppli hasn't gotten
its hands on one yet for a real teardown. But based on its educated
guesses, Apple is spending about $173 for components and manufacturing
for each 8-gigabyte 3G iPhone. That's $53 less (23%) than they spent to
build the original 8-gig iPhone.
[Assuming a $499 wholesale price and $45 in royalties,] Apple's per-unit
profit on an 8GB iPhone works out to about $281, or about 56%, in
keeping with the percentage on other Apple products, iSuppli says. The
figure doesn't include other costs, including software development,
shipping and distribution, packaging, and miscellaneous accessories
included with each phone. Apple also pays fees to its Chinese
manufacturing partner, Hon Hai Precision Industry.
How does iSuppli's fantasy teardown compare to other estimates? Earlier
this month, Portelligent estimated that Apple's bill of materials for
the 3G iPhone "could be as low as $100," or 41% less than the $170
Portelligent says they spent for the old iPhone. But as far as we can
tell, that doesn't include manufacturing charges, so it's not a
one-to-one comparison to the iSuppli estimate.
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